توضیحات
اطلاعات کتاب:
| نویسنده: Manho Lee , Jun So Pak , Joungho Kim | ISBN-10: 940179037X |
| ناشر: Springer | ISBN-13: 978-9401790376 |
| ویرایش: 2014 | تاریخ انتشار: May 12, 2014 |
| تعداد صفحات: 280 | رتبه فروش در سایت آمازون: #423 در دسته ی Expert Systems |
| فرمت کتاب: pdf | #1624 در دسته ی Design |
| کیفیت صفحات: اصلی | #4734 در دسته ی Networking |
خلاصه ای از کتاب:
Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.
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